Printed circuit boards (PCBs) are an indispensable core component of electronic products, and their design quality is directly related to the performance, reliability and manufacturability of the entire product. As electronic products continue to develop towards miniaturization, high speed and multi-function, PCB design is also facing higher and higher technical challenges. In the actual design process, there are five key issues that must be highly valued. This article will analyze them one by one for reference and reference.
The design of the power layer and the ground layer is the basis for ensuring the stable operation of the circuit. Reasonable power distribution and ground line planning can not only reduce power supply noise and ripple, but also effectively control electromagnetic interference.
Suggestions:
Try to use the entire ground layer to improve the continuity of signal return.
Power supplies of different voltages should be arranged in different areas to avoid crosstalk.
The ground line should be kept intact to avoid "islands" or breaks.
With more and more high-speed signals, signal integrity issues (such as reflection, crosstalk, and overshoot) have become the focus of design. PCB wiring must consider factors such as impedance matching, routing length, and layout of interlayer vias.
Key measures include:
Keep the length of high-speed signal lines consistent to reduce deviations.
Control routing impedance and add matching resistors when necessary.
Avoid high-speed signals from crossing split power layers or ground layers.
The layout of components directly affects wiring efficiency, heat dissipation performance, and subsequent production assembly. Reasonable layout can improve overall design quality and reduce production costs.
Layout suggestions:
First layout key components, such as main control chips, power modules, etc.
High-speed signals give priority to the shortest path layout.
Pay attention to the heat dissipation path of heat source devices to avoid stacking heating components.
Although vias are an effective way to connect different layers, improper number and position may cause signal distortion, complex processes, and even reduced structural strength. Too many layers increase costs, and too few layers limit wiring freedom.
Design ideas:
Optimize the use of vias to reduce signal path jumps.
Try to use blind and buried vias to optimize high-density design.
Balance the number of layers and cost, and reasonably allocate power, ground, and signal layers.
A good PCB design not only meets the electrical performance requirements, but also takes into account the manufacturing feasibility and subsequent testing requirements. Ignoring the manufacturing process limitations may lead to rework or even scrap.
Common practices include:
Reserve sufficient test points to facilitate functional verification and production line testing.
Consider whether the pad size and device spacing meet the requirements of the patch process.
Avoid extremely fine lines or isolated copper areas in the design that are not conducive to copper foil etching.
A high-quality PCB design is inseparable from strict control of details. From early planning to layout and wiring, to later production processes and testing, each step requires experience and rigorous engineering specifications. Our company has rich experience in PCB design and manufacturing. Our technical team is familiar with various industry application standards and can provide customers with one-stop services from schematic design, PCB layout to sample production.
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