Fanway specializes in delivering efficient and reliable end-to-end PCB assembly services, precisely tailored to your unique requirements to accelerate your product success.
As a leading China-based electronics manufacturer and supplier, Fanway delivers mixed PCB assembly services that strategically combine:
• Surface Mount Technology (SMT) - For ultra-compact designs with 01005 components (0.4×0.2mm) and 0.3mm-pitch BGAs.
• Through-Hole Technology (THT) - For mission-critical connections requiring >50N pull strength and MIL-STD-202G vibration compliance.
This synergy of technologies enables:
✅ 25% Higher Power Density with mixed HDI+THT stackups.
✅ High Reliability (IPC-A-610 Class 2 certified processes).
✅ 30% Cost Reduction versus separate SMT/THT production.
* Design and Layout: The PCB design should be accommodated both SMT and THT components, considering factors such as component placement, routing, and thermal management. As well as design for manufacturability principles to ensure ease of assembly and reliability.
* Solder Paste Application: Using a stencil to apply the solder paste to the PCB pads for SMT components.
* Component Placement: SMT components are placed onto the solder paste using pick-and-place machines. THT components are manually or automatically inserted into the drilled holes.
* Reflow Soldering: For SMT components, the PCB is passed through a reflow oven to melt the solder paste and form electrical connections.
* Wave Soldering: For THT components, the PCB is passed over a wave soldering machine, where a wave of molten solder forms connections on the underside of the board.
* Inspection and Testing: Every PCBA have inspected by Automated Optical Inspection (AOI) and X-ray inspection to check soldering defects and component placement accuracy.
| Dual-Technology Expertise |
Mastering both SMT (01005 components) and THT (axial leads up to 50mm), we handle: • High-density ICs + rugged connectors on single PCBA • Mixed RF/digital boards with EMI shielding requirements • Automotive-grade solder joints (IPC-610 Class 2) |
| Smart Hybrid Production Lines |
• DEK Horizon 03iX printers: ±15μm solder paste deposition • Universal Instruments GSM™ placement: 85, 000 CPH (SMT) + 1, 200 CPH (THT) • Heller 1913 MK5 reflow: 10-zone nitrogen control for lead-free alloys |
| Zero-Compromise Quality |
• 3D SPI + AOI + functional testing: 99.2% first-pass yield • X-ray inspection for hidden BGA/THT solder joints • Full traceability: Component-level data logging (AS9100 compliant) |
| Experienced Team | • Skilled engineers and technicians with expertise in mixed assembly |
| Flexible Solutions | • Support for prototyping, low-volume, and high-volume production. |
| End to End solutions | • Comprehensive services including PCB design, component sourcing, PCB assembly, testing, box building, case assembly, packaging, and delivery. |
1. 30% Faster Time-to-Market
Prototype-to-production in 72 hours with our NPI (New Product Introduction) accelerator program
2. Cost-Effective Scalability
Batch size flexibility: 10pcs (prototype) to 500k+ (volume) with ±2% cost predictability
3. Risk-Free Supply Chain
• Anti-counterfeit screening (XRF/decapsulation testing)
• TI/STMicroelectronics authorized sourcing
• Dual-source component validation
• ECU control modules (SMT MCUs + THT power relays)
• LiDAR sensor arrays: 0.4mm-pitch QFNs + shielded THT connectors
• Portable ultrasound: HDI boards + THT transducer interfaces
• ISO 13485 compliant cleaning (≤1.0μg/cm² ionic residue)
• Avionics controllers: MIL-SPEC conformal coating + THT press-fit pins
• Computer network communications
Aerospace & Defense
Automation Electronics
Medical Devices
Telecommunications
Address
Building 3, The First Industrial Zone of Mingjinhai, Shiyan Street, Bao'an District, Shenzhen, Guangdong, China, Zip Code:518108
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