The global electronics industry is undergoing a transformative phase, driven by rapid development in artificial intelligence (AI), 5G connectivity, the Internet of Things (IoT), and automotive electronics. At the heart of this transformation lies the High-Density Interconnect (HDI) PCB market, which is experiencing incredible growth.
HDI PCB is a printed circuit boards with a higher wiring density per area than traditional PCB. They are featured thinner trace widths and spaces enable more connections in a smaller area. Mircovias allows for high-density interconnections, the small holes typically less than 150 microns in a diameter. Blind and buried vias can connect inner layers without reaching the outer layers, reducing the board’s size and improving signal integrity. The PCBs can have 20 or more layers to support complex circuit designs.
Due to HDI PCB with high performance, reliability and compactness, it is widely used in the various industries such as consumer electronics, telecommunication, automotive electronics, medical device and industrial automation.
Here are Classification of HDI PCBs Based on their complexity and Technical
| Technological Class | Structure | Complexity | Applications |
| HDI Class 1 | 1+N+1 | Low | Basic consumer electronics, simple devices |
| HDI Class 2 | 2+N+2 | Medium | Advanced consumer electronics, automotive |
| HDI Class 3 | 3+N+3 | High | High-performance devices, 5G, AI systems |
| HDI Class 4 | 4+N+4 | Extremely High | Cutting-edge applications, semiconductor |
