Multilayer PCBs support complex circuit designs, enabling high-speed signal transmission, RF communication, and high-power applications.
Multilayer PCB is suitable for high-density portable devices such as smartphones and tablets. It integrates complex circuits through a multi-layer structure to meet the needs of miniaturization and lightweighting, while optimizing signal transmission performance and improving device operation speed and stability.
Support high-speed signal transmission and RF communication for 5G base stations, routers, and other devices, reduce electromagnetic interference through power and ground layer design, ensure signal integrity, and help build a stable and efficient communication network.
Applied to industrial robots and automation control systems, utilizing the heat dissipation layer design of Multilayer PCB to enhance thermal management capabilities, ensuring the reliability and lifespan of equipment in high-power, long-term operating scenarios, and adapting to the stringent requirements of industrial environments.
Meeting the requirements of high-end equipment such as radar and satellite communication for compact layout and high electrical performance, the multi-layer structure can integrate complex circuits and achieve lightweight, while ensuring signal stability in extreme environments through anti-interference design.
For in car electronic systems such as ADAS and infotainment systems, the adaptive design of Multilayer PCB is compatible with high-speed data transmission and high-power applications, helping to upgrade the intelligence and networking of automobiles, while the compact structure adapts to the limitations of in car space.
