From PCB design to mass production, Fanway delivers quick-turn PCB manufacturing services as one-stop solutions to address your diverse project requirements and accelerate your time-to-market.
HDI PCB (High-Density Interconnect PCB) is a type of printed circuit board offering significantly higher wiring density per unit area compared to traditional PCBs. HDI PCB fabrication has rapidly become the ultimate solution for designing smaller, more compact, and durable electronic devices. Key features include:
Thinner trace widths/spaces (down to 3/3 mil) enabling denser connections in constrained areas.
Microvias (typically <150μm in diameter) facilitating high-density interconnections between layers.
Blind/buried vias connecting inner layers without penetrating outer surfaces, reducing board size by up to 60% while enhancing signal integrity.
High layer counts (up to 20+ layers) to support complex multilayer architectures.
As an HDI PCB specialist, Fanway Technology leverages 12+ years of experience in advanced HDI manufacturing to deliver tailored solutions for industries requiring precision and reliability:
Medical: Implantable devices, diagnostic equipment.
Automotive: ADAS, EV battery management systems.
5G Communications: High-speed server boards, mmWave modules.
Consumer Electronics: Foldable smartphones, miniaturized IoT sensors.
Fanway is committed to being your trusted HDI PCB provider and supplier in China, combining ISO 9001-certified processes with IPC-6012 Class 3 standards to ensure mission-critical performance.
We have a strict quality control system in manufacturing, we have various testing such AOI, X-Ray, electrical testing and so on to inspect PCB and components ensuring a high quality product.
We have a stable supply chain that enables us to get raw materials at lower costs. Online tracking system and All-in-One manufacturing can help us reduce the cost.
Online tracking system allows us to track your order status and better control the production schedule and deliver HDI PCB in time.
Our dedicated team help you from concept to production.
| Technological Class | Structure | Complexity | Applications |
| HDI Class 1 | 1+N+1 | Low | Basic consumer electronics, simple devices |
| HDI Class 2 | 2+N+2 | Medium | Advanced consumer electronics, automotive |
| HDI Class 3 | 3+N+3 | High | High-performance devices, 5G, AI systems |
| HDI Class 4 | 4+N+4 | Extremely High | Cutting-edge applications, semiconductor |
| Layer Count | 1-108L |
| Finish Board Thickness | 0.2mm-10.0mm |
| Max Panel Size | 610mm *1200mm |
| Finish Copper thickness | 0.5OZ-12OZ |
| Min Line Width | 2.5mil/2.5mil |
| Min Finish Hole Size | 0.1mm |
| Max Aspect Ratio | 25:1 |
| Impedance Control Tolerance | +/-10% |
| Surface finishes | HASL (LF), ENlG, lmmersion Tin, lmmersion silver, Golden finger, Full board with hard gold plating, OSP, ENEPlG |
| Materials: | FR-4 TG150/TG170, Rogers, Arlon, Taconic, TUC TU-872 SLK, TU-883, Panasonic M6/M7, Bergguist etc. |
6L LED Photoelectric PCB with 1-Step HDI
8L Laptop Motherboard with 2-Step HDI
14L Rogers Hybrid PCB with 1-Step HDI
Multilayer HDI Blind Via PCB
Address
Building 3, The First Industrial Zone of Mingjinhai, Shiyan Street, Bao'an District, Shenzhen, Guangdong, China, Zip Code:518108
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