Accelerate Your Electronic Manufacturing with Fanway's Integrated Expertise
PCB fabrication transforms a design into a physical board structure. Blank boards can be manufactured in various colors. The PCB manufacturing process involves multiple stages: design finalization, material cutting, inner layer processing, multi-layer lamination, drilling, outer layer processing, solder mask and surface finish routing or profiling, and inspection.
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PCB Design: This is the foundational process of creating the physical layout and electrical interconnections for printed circuit boards (PCBs). It bridges electronic schematics to manufacturing hardware. At the meantime, designer needs to analysis covering application scenarios, electrical design feasibility, structural or material feasibility, production efficiency, and cost evaluation.
Material Cutting: It also called panelization or blank cutting. The large sheets of raw substrate like FR-4, Rogers, or polymide are cut into required dimensions.
Inner Layer Processing: It is a core process in PCB manufacturing, using the pattern plating etching method to precisely form the required circuit patterns on the copper foil of the copper-clad laminate. The manufacturing processing including:
Base Material Preparation (Cleaning CCL) → Photoresist Coating → Exposure Imaging (Film/LDI) → Development (Exposing Copper to be Etched) → Etching (Removing Excess Copper) → Stripping (Revealing Copper Traces) → Cleaning & AOI Inspection → Browning/Oxidation Treatment → Completion of Inner Core Layer.
Lamination: PCB Lamination is bonding multiple layers of copper-clad cores and prepreg (PP) under high temperature and pressure to form a solid multi-layer board. Lamination ensures electrical connectivity between layers and structural integrity.
Drilling: PCB Drilling is creating holes in laminated PCBs for electrical interconnections (vias) and mechanical mounting. It requires micron-level accuracy and directly impacts signal integrity, reliability, and manufacturability.
Outer Layer Processing: It determines the visible conductive patterns (wires, pads, etc.) on the circuit board. Typically, the graphic electroplating and etching method is used to precisely retain the desired copper patterns on the copper-clad board while removing the excess copper foil.
Solder Mask and Surface Finish: Solder mask and surface finish are closely interrelated and critically important in printed circuit board (PCB) manufacturing. They directly impact the PCB's reliability, solder-ability, appearance, and long-term performance. Solder mask covers the copper traces, preventing short circuits and providing insulation protection. During soldering, it confines the solder to the pads, preventing bridging between adjacent traces. It also resists scratches, chemicals, and humid environments, and provides colors such as green, black, or blue, along with legend printing (white ink). Surface finish protects the copper layer, preventing pad oxidation and maintaining solder-ability. It ensures reliable soldering of components to the PCB and adapts to different assembly processes.
Routing or Profiling: This is the final mechanical process of cutting the outline of a printed circuit board from a larger production panel.
Inspection: It includes flying probe testing, ICT testing, final FQC to check size, diameter of holes, solder mask integrity, marking clarity, etc.
Although PCB manufacturing is a separate stage independent of the PCB design flow, it is still essential to understand how it works. PCB manufacturers may not know why you designed the board or its intended purpose. However, when you understand how these boards are manufactured, you can establish corresponding design specifications to ensure the final product achieves the highest possible quality level.
Yield Rate: If design parameters exceed the capabilities of the manufacturing equipment, the resulting boards may fail to function correctly. So designers and manufacturers need a shared understanding of the intended application.
Manufacturability: Your design impacts whether the board can be produced actually. If there isn't sufficient clearance between the board edge and surface components, or if the materials you choose lack an adequate coefficient of thermal expansion (CTE), then the board might not be produced.
Classification: According to end use, PCB classes C/M level (high precision), B/L grade (medium precision), A/K grade (standard accuracy).
| Layer Count | We support multi-layer PCB manufacturing, ranging from 3 layers to 108 layers, to meet designs of varying complexity. |
| Material Support | We offer a variety of substrate options, including FR4, high-frequency materials (such as Rogers), metal substrates, and more, to suit different application scenarios. |
| Advanced Technology | Our advanced technology is customized to your needs. Blind or Buried Via technology enables high-density interconnects and reduces signal path length. HDI supports micro-vias and fine-line designs, while Impedance Control ensures stable high-speed signal transmission. |
| Surface Treatment | We offer a variety of surface treatments, including ENIG, HASL, OSP, immersion gold, and more, to meet welding and corrosion resistance requirements. |
| Quality Control | Every PCB undergoes AOI, X-Ray, and flying probe testing to ensure high reliability. |
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