From PCB design to mass production, Fanway delivers quick-turn PCB manufacturing services as one-stop solutions to address your diverse project requirements and accelerate your time-to-market.
Fanway is committed to being your trusted multilayer PCB manufacturer and supplier in China, delivering fast-turn solutions while maintaining high quality.
High Density Design: The multilayer structure allows more circuits to be integrated into a limited space, suitable for high-density electronic devices.
High Electrical Performance: Properly designing the power and ground layers helps reduce electromagnetic interference (EMI) and signal crosstalk, while improving signal integrity.
Strong Ability of Thermal Management: The multilayer design can integrate a heat dissipation layer, effectively dispersing heat to improve product reliability and lifespan.
Lightweight and Miniaturization: Multilayer PCBs help reduce the need for external connections, which makes the device lighter and more compact.
Adaptability Design: Multilayer PCB supports complex circuit designs, enabling high-speed signal transmission, RF communication, and high-power applications.
With extensive experience in multilayer PCB manufacturing, we serve a wide range of industries, meeting diverse needs with our expertise.
We are equipped with advanced equipment and cutting-edge technology, ensuring high accuracy and efficiency in every project.
We offer customized design, material selection and process optimization services according to customer requirements.
We provide quick-delivery prototype to low volume production services to shorten your product development cycle.
| Increased Layer Count | We support multilayer PCB manufacturing, ranging from 3 layers to 108 layers, to meet designs of varying complexity. |
| Material Support | We offer a variety of substrate options, including FR4, high-frequency materials (such as Rogers), metal substrates, and more, to suit different application scenarios. |
| Advanced Technology | Our advanced technology is tailored to your needs. Blind/Buried Via technology enables high-density interconnects and reduces signal path length. HDI supports micro-vias and fine-line designs, while Impedance Control ensures stable high-speed signal transmission. |
| Surface Treatment | We offer a variety of surface treatments, including ENIG, HASL, OSP, immersion gold, and more, to meet welding and corrosion resistance requirements. |
| Quality Control | Every PCB undergoes AOI, X-Ray, and flying probe testing to ensure high reliability. |
Telecom: 5G base stations, RF amplifiers.
Automotive: EV powertrains, ADAS modules.
Industrial: Motor controllers, PLC systems.
Medical: Imaging equipment, patient monitors.
Address
Building 3, The First Industrial Zone of Mingjinhai, Shiyan Street, Bao'an District, Shenzhen, Guangdong, China, Zip Code:518108
Tel
