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Shenzhen Fanway Technology Co., Ltd.
Shenzhen Fanway Technology Co., Ltd.
Products

Printed Circuit Board Assy

Printed Circuit Board Assy: High-Quality Electronic Solutions

When it comes to PCB Assembly And Manufacturing, precision and reliability are key. Our advanced PCB Fabrication Assembly processes ensure that every circuit board meets the highest standards for durability and performance. We specialize in Surface Mount PCB technology, which allows for compact, efficient designs ideal for modern electronics. Additionally, our comprehensive Electronic Circuit Board Assembly services cover everything from prototyping to mass production, ensuring seamless integration into your devices. With state-of-the-art equipment and rigorous quality control, we deliver solutions that exceed expectations in various industries, including automotive, medical, and consumer electronics.


Our Printed Circuit Board Assy is engineered to provide exceptional performance and longevity. We utilize cutting-edge materials and manufacturing techniques to ensure that each board operates reliably under demanding conditions. The Printed Circuit Board Assy features multi-layer designs that support complex circuitry, enhancing functionality while minimizing space requirements. Key benefits include improved signal integrity, reduced electromagnetic interference, and superior thermal management. This makes the Printed Circuit Board Assy suitable for high-frequency applications and environments with extreme temperatures. By focusing on innovation and customer-specific requirements, we guarantee that the Printed Circuit Board Assy integrates seamlessly into your projects, boosting overall efficiency and reducing time-to-market.

Detailed Product Parameters

Parameter Specification Testing Method
Dielectric Constant 4.2 to 4.6 at 1 MHz IPC-TM-650
Thermal Conductivity 0.3 to 3.0 W/mK ASTM D5470
Peel Strength ≥ 8 lb/in IPC-TM-650 2.4.8
Insulation Resistance ≥ 10^8 MΩ IPC-TM-650 2.5.17.1
Flammability Rating UL94 V-0 UL 94 Vertical Burn Test
Moisture Absorption ≤ 0.2% IPC-TM-650 2.6.2.1
Surface Insulation Resistance ≥ 10^9 Ω after humidity testing IPC-TM-650 2.6.3.3
Plating Thickness 0.8 to 1.2 mil for gold; 100-300 µin for nickel X-Ray Fluorescence

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